8324L
Thermally conductive polyurethane adhesive
For structural and thermal bonding between cells, modules and cooling plates, balancing performance and cost.
Enquire about this product ↗Structural bonding, thermal bonding and low-density foam potting for power and energy storage battery modules and packs.

Low-density foaming polyurethane potting compound for 46-series cylindrical, prismatic and pouch-cell modules and packs.
Enquire about 8131F ↗For structural and thermal bonding between cells, modules and cooling plates, balancing performance and cost.
Enquire about this product ↗An 8324-series thermal bonding option for battery pack thermal management.
Enquire about this product ↗For thermal bonding in battery modules and packs. Processing conditions depend on the application.
Enquire about this product ↗An 8324-series product for thermal management and structural connections in battery systems.
Enquire about this product ↗For pack structural bonding across substrates including aluminium, plastics and composites.
Enquire about this product ↗Structural bonding designed around lightweight assemblies, curing efficiency and automated application.
Enquire about this product ↗For 46-series cylindrical, prismatic and pouch-cell modules and packs, with self-levelling before uniform foaming.
Enquire about this product ↗For side and top potting in battery assemblies, supporting sealing and cushioning.
Enquire about this product ↗For side and top battery potting, selected around module packaging requirements.
Enquire about this product ↗For full-pack potting, providing an option for overall protection and structural stability.
Enquire about this product ↗For full-pack potting and protection across different battery-system configurations.
Enquire about this product ↗For structural and thermal bonding between cells, modules and cooling plates, with consideration for subsequent disassembly.
Enquire about this product ↗No matching products. Try another keyword.
Product performance depends on the formulation, substrates and application conditions. Refer to the latest applicable technical data and application validation for specifications and processing guidance.
Application options include low-density structural adhesives, debondable thermal structural adhesives and enclosure sealants. Contact our technical team for model selection and process compatibility.
